As an important sub industry of the electronic components industry, connectors are widely used, existing in both daily consumer electronics products and high-end defense products. CAE analysis in the connector industry includes analysis of insertion and extraction force, terminal retention force, positive pressure, insertion and extraction life, vibration, impact, lifting force, temperature rise, high frequency, mold flow, cold and hot shock, etc.
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By analyzing the insertion and extraction forces, the magnitude of the insertion and extraction forces during the terminal insertion process can be obtained. During this process, the amount of stress generated by the terminal and whether there is any strain can be determined; If strain occurs, what is the magnitude of the yield.
The analysis of terminal holding force can accurately calculate the axial force that the terminal bears after being installed in the plastic shell, as well as the stress distribution and whether the terminal has produced strain; If strain occurs, what is the magnitude of the yield.
Conducting forward force analysis on the terminal can determine the magnitude of the force required when the terminal is subjected to a certain amount of compression, as well as the amount of stress and strain generated by the terminal under that compression; If strain occurs, what is the magnitude of the yield.
Due to the electrical resistivity of the material, connectors generate a large amount of heat during use, which can cause a significant decrease in connector performance and even lead to functional failure. Therefore, temperature rise analysis is also a major indicator for judging the quality of connectors.
High frequency connectors are key components in telecommunications and data communication that affect the overall signal transmission quality of the system, and they have become a bottleneck in improving transmission rates.
In order to ensure high-quality production of products, customers require mold flow analysis of the original mold design, including filling analysis, warping analysis, shrinkage analysis, runner (same mold but different cavity products) balance analysis, optimal gate position analysis, optimal molding process analysis, stress analysis, injection pressure and locking force, etc.
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The structure of the connector is often more complex, and its force is also more diverse. Through CA
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