We provide targeted finite element analysis solutions for various linear, nonlinear, thermal coupling, wet thermal coupling, drop, cracking and other mechanical problems in the electronic field
We provide you with industry solutions to improve product development cycles
The strength, stiffness, and stability verification of structural components of electronic devices such as mobile phones, cabinets, and household appliances when they collide with different material surfaces at different heights and speeds.
Collision of electronic products such as computers during transportation, response spectra and random vibrations of cabinets in earthquake response, and other related issues.
Flow and warpage analysis of electronic products during injection molding, as well as analysis of the optimal gate position to shorten the molding cycle.
Electronic products such as connectors have characteristic impedance, crosstalk, signal loss, etc. in high-frequency signal testing.
Analyze and optimize the internal layout of electronic devices, improve the cooling system inside electronic devices, and reduce the adverse effects caused by temperature rise.
When household appliances are transported with packaging and collide with different material surfaces at different heights and speeds during transportation, the strength, stiffness, and stability of structural components are checked when the appliances are stepped on by people with packaging.
The packaging design of household appliances has been cracked in the analysis of falling and trampling, and the packaging has been optimized to make it thinner and stronger.
The strength, stiffness, and stability verification of structural components of household appliances when impacted by steel balls from different heights and speeds on surfaces of different materials.
Flow and warpage analysis of household appliance parts during injection molding, as well as analysis of the optimal gate position to shorten the molding cycle.
Our years of project experience provide strong support for your product development
The main purpose of the drop simulation analysis is to evaluate the drop resistance of AR glasses an
Since 2007, We has provided professional CAE simulation analysis and consulting services to more than 1400 customers around the world.
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