Analysis of mobile phone heat dissipation

FEA projects Mobile Phone 0


Location of customer: China
Customer consultation project: mobile phone thermal analysis
Project completion time: August 6, 2020

This project is a Chinese mobile phone company found us on the Internet, according to the requirements of a mobile phone heat dissipation simulation analysis.

With the rapid development of electronic technology,mobile phones and other electronic devices are increasingly rich in functions,but they also face the challenge of heat dissipation. ‌ In order to solve this problem, ‌CAE simulation technology is widely used in the process of mobile phone heat dissipation design.The Chinese phone company approached us about using CAE simulations ‌ to allow its engineers to predict product performance even during the design phase ‌, avoiding the time and cost of later physical testing.Especially in thermal management, ‌CAE simulation can help engineers quickly analyze the efficiency of a product's cooling system,optimize product design,select better materials and design options,to improve the heat dissipation capacity of a product. ‌

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To improve heat dissipation efficiency,designers have adopted a variety of strategies, including using thermal interface materials (‌TIM) to fill the gap between the heat source and the heat sink,utilizing high-conductivity materials such as aluminum or copper as heat sinks,and employing heat pipe technology, among others.The application of each of these strategies needs to be validated and optimized through CAE simulations to ensure that the product also effectively dissipates heat while remaining compact and portable. ‌

Through this project, we have established a good cooperative relationship with the company and provided more finite element analysis services.

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